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This handbook concentrates on a variety of design and manufacturing techniques and materials used in high reliability military and commercial power hybrids, and is an attempt to distill my experience into a conveniently compact, readable, and yet authoritative reference. It was developed to provide a handson approach to learning the necessary tools and techniques to those who wish to understand the theory and practice of hybrid microelectronics. Some of it is addressed to the engineer who has had little experience with hybrid microelectronics, and to the advanced engineering student. Other parts of the text are intended for engineering managers, systems designers and hybrid development engineers. The first chapter conta ins a general introduction into hybrid microcircuit technology and provides comparisons of alternative electronic packaging techniques. Chapter 2 describes a vast variety of components used in power hybrids: principles of their operation and guidelines for selection. Chapter 3 is dedicated to materials used in the construction of power hybrids with practical recommendations for their selection and use. Chapter 4 focuses in detail on design issues: process flow, system partitioning, package selection and design guidelines with step-by-step instructions to assure performance, reliability, and manufacturability of the power hybrid microcircuits. The information discussed in Chapter 5 is needed to understand the thermal characteristics of materials used in power hybrid construction, guidelines for their selection and methods of process control and hybrid performance evaluation. Chapter 6 provides a description of current manufacturing processes and methods used in production. They include substrate fabrication, assembly and testing. The last chapter contains information on advanced applications of power hybrids and modules