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Smart power integration is at the crossroads of different fields of electronics such as high and low power, engine control and electrothermal studies of devices and circuits. These circuits are complex and are heavily influenced by substrate coupling, especially where 3D integration is concerned. This book provides an overview of smart power integration, including high voltage devices, dedicated and compatible processes, as well as isolation techniques.
Two types of integration are highlighted: modular or hybrid integration, together with compatible devices such as the insulated gate bipolar transistor (IGBT) and monolithic integration, specifically through the paradigm of functional integration. Smart Power Integration outlines the main MOS devices for high voltage integrated circuits, and explores into the fields of codesign, coupling hardware and software design, including applications to motor control. Studies focusing on heat pipes for electronics cooling are also outlined.
Smart integration is a process in which an existing system infrastructure is upgraded through the integration of multiple technologies, for example, automated sensors, advanced automated controls and forecasting systems. A smart grid allows for interaction between the consumers and enables optimal use of energy and communication systems based on price preferences and system technical stresses, without forgetting the environmental aspect.
The continuous reduction in dimensions and the need for increasingly high power density have highlighted the need for ever more efficient structures. Smart power technology has been developed to meet this demand. This technology makes specific use of (L)DMOS devices, offering new solutions because of its unique high voltage and high current characteristics. The operation of these devices is accompanied by a number of phenomena. Good modeling makes it possible to account for these phenomena and predict the physical behavior of the transistor prior to production. To this, we add an axis that has become unavoidable: the entanglement between devices, circuits, connections and substrates.
(Micro)grid designs have evolved significantly in recent years with the incorporation of information and communication technology (ICT) solutions, such as artificial intelligence (AI) and machine learning (ML). A smart microgrid, equipped with sensors and automation controls, can efficiently perform load profiling and forecasting, generation management, load prioritization, etc. A go-to example is the vehicles that are quickly becoming a center of communication, navigation and connectivity. Automotive solutions will integrate with smart city infrastructures, personal devices and in-vehicle services to become part of a connected whole