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This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement.
Now in a widely extended second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. Twelve new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging.
Nanopackaging: Nanotechnologies and Electronics Packaging
Modelling Technologies and Applications
Advances in Delamination Modeling of Metal/Polymer Systems: Continuum Aspects
Advances in Delamination Modeling of Metal/Polymer Systems: Atomistic Aspects
Soft Mold Nanoimprint: Modeling and Simulation
Nanoparticle Properties
Nanoparticle Fabrication
Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges
Nanostructured Resistor Materials
Inductors: Micro- to Nanoscale Embedded Thin Power Inductors
Nano-conductive Adhesives
Nano-materials in Anisotropic Conductive Adhesives (ACAs)
Nanoparticles in Microvias
Silver Nanoparticles for Inkjet-Printed Conductive Structures in Electronic Packaging
A Study of Nanoparticles in SnAg-Based Lead-Free Solders
Nano-underfills and Potting Compounds for Fine-Pitch Electronics Carbon Nanotubes: Synthesis and Characterization
Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications
High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Nanotubes
Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes
Nanowires in Electronics Packaging
Nanowire ACF for Ultrafine-Pitch Flip-Chip Interconnection
Carbon Interconnects
Carbon Nanotubes for Thermal Management of Microsystems
Synthesis and Optical Characterization of CVD Graphene
Characterization of Electronic, Electrical, Optical, and Mechanical Properties of Graphene
Graphene Applications in Advanced Thermal Management
Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging
Nanosensors for Electronics Package Reliability
Application of Bio-nanotechnology to Electronic Packaging
Flip-Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities
Nanotechnology Health, Safety, and Environment Overview