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Textbook in PDF format

Preface.
Acknowledgments.
Advanced Packaging Landscape for Heterogeneous Integration.
Direct Copper Interconnection for Die/Wafer Bonding: Overview.
Hybrid Bonding Process Technology.
Materials for Hybrid Bonding.
Copper Electrodeposition for Advanced Packaging and Hybrid Bonding.
Planarization for Advanced Packaging and Hybrid Bonding
Permanent and Temporary Wafer Bonding.
Die-to-Wafer Hybrid Bonding for Direct Copper Interconnections.
Design for Hybrid Bonding and Chiplets.
Thermal Modeling and Simulation for Advanced 3DIC Systems.
Characterization, Modeling, and Reliability for Direct Copper Interconnection.
Applications of Hybrid Bonding and Chiplets for Heterogeneous Integration